Dear Colleagues and Friends,


The US National Science Foundation (NSF) has provided funding (pending final processing) to support registration and travel to the S3PM-2017 Convention (Berkeley, CA, June 19-23) for a limited number of

·  ​​Students enrolled in US educational institutions (including domestic and international students); OR

·  ​

US persons (citizens or lawful permanent residents) who are graduate students in universities outside of the US.

Unfortunately, we cannot support postdocs.

For students awarded travel support, the NSF grant will cover actual documented costs, up to a maximum of $1450, including reimbursement of the registration fee (up to $550), up to five nights shared hotel accommodation (up to $500), and airfare or other travel costs (up to $400).

 

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Applications from women and under-represented minorities are particularly encouraged. Priority will be given to students who are presenting a paper or poster and/or serving as a student volunteer.


Please use the following link to apply: https://goo.gl/5lZHy9

 

Deadline: May 17th -- the same as the last day for S3PM-2017 early registration discount. But we will consider applications after the deadline if the funds are still available.

Submission: All information and documents must be uploaded at the above link. Please DO NOT send application materials via e-mail.

S3PM-2017: The international convention on Shape, Solid, Structure, and Physical Modeling will host the

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 two prime conferences in this area:

1.     The Symposium on Solid and Physical Modeling (SPM); and

2.     The Shape Modeling International (SMI) Symposium.

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It will also Include the Fabrication and Sculpting Event (FASE), the 

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Pierre Bézier Award Ceremony held by the Solid Modeling Association (SMA), keynote speakers of international reputation, industry panels, and several mini-symposia on important cutting-edge topics and research directions.

For more details about the conference events, venue, agenda, speakers, and other logistics, see https://s3pm.icsi.berkeley.edu.

 

​Regards,

Morad Behandish, Publicity Chair​