Call for Submissions 3DV Conference (Third Joint 3DIM/3DPVT Conference)
Web: http://www.3dv.org
Email: chairs3dv@gmail.com

We are now accepting retargeted SIGGRAPH submissions to the 3DV (3D Vision) conference

to be held June 29 - July 1, 2013 in Seattle, Washington, following CVPR in nearby Portland, Oregon.

The deadlines for SIGGRAPH re-submissions are:

  April 2 -- 18:00 (6pm) PST -- main paper
  April 9 -- 18:00 (6pm) PST -- supplementary material
More details can be found on the conference web site: http://www.3dv.org

This meeting will be a continuation of the successful 3DIM and

3DPVT conference series. Submissions are solicited on topics related to
acquiring, modeling, analyzing, and visualizing 3D data. The event will
provide a premier forum for disseminating ideas and results that cover a
broad scope of topics related to 3D research in computer vision and
graphics, from novel optical sensors, signal processing, geometric
modeling, representation, and transmission, to visualization and
interaction, and a variety of applications. The organizers invite you to

submit high quality, original full research papers.

Topics of interest include, but are not limited to:

ACQUISITION & MODELING

*       3D cameras and sensors
*       Real-time 3D systems
*       Automated view planning
*       3D sensor calibration
*       Image-based modeling
*       Shape-from-X
*       Shape and appearance modeling
*       4D capture

INTERACTION & VISUALIZATION

*       Image and video-based rendering
*       Interactive modeling
*       Augmented and mixed reality
*       3D printing and rapid prototyping
*       Psychophysics of 3D sensing

PROCESSING & TRANSMISSION

*       Geometric signal processing
*       Multi-resolution 3D representations
*       3D shape retrieval and recognition
*       Shape analysis and morphology
*       3D compression and transmission

APPLICATIONS

*       Reverse engineering
*       Dimensional inspection & metrology
*       Cultural heritage & architecture
*       Medical visualization and analysis
*       Urban modeling
*       Robotics
*       3D television
*       3D tele-immersion
*       Forensics and security

General Chair
Brian Curless, University of Washington

Program Co-Chairs
Yasutaka Furukawa, Google Inc.
Ioannis Stamos, City University of New York
Camillo J. Taylor, University of Pennsylvania