CFP for Solid and Physical Modeling (SPM-2017). Abstract due Feb 18.

Dear friends,

We are preparing a wonderful convention next summer in Berkeley that will focus on geometric and computational tools and paradigms for designing, representing, analyzing, and simulating Shapes, Solids, and Structures. Please consider contributing with paper submissions and your presence. Also, please help us promote this CFP by forwarding to colleagues and students. Hope to see you there.

- Vadim, Sara, Mario, Stefanie, Jessica, Leah

Solid and Physical Modeling (SPM-2017)

https://s3pm.icsi.berkeley.edu/s3pm/spm.html

WHEN:         SPM (June 19th – 21st) followed by SMI (June 21st – 23rd)

WHERE:       UC Berkeley Campus, Berkeley, California, USA

The Symposium on Solid and Physical Modeling 2017 (SPM-2017) will be co-located in Berkeley, California with Shape Modeling International (SMI) as part of the International Convention on Shape, Solid, Structure & Physical Modeling (S3PM-2017).

SPM seeks high quality, original research contributions that strive to advance all aspects of geometric and physical modeling, and their application in design, analysis and manufacturing, as well as in biomedical, geophysical, digital entertainment, and other areas.  The symposium is organized with the support of the Solid Modeling Association (SMA), which will award the 2017 Pierre Bézier Prize for contributions to solid, shape, and physical modeling during the conference.

Accepted full-length papers will be published as a journal special issue in Computer-Aided Design (Elsevier).

TOPICS:

•3D fabrication/printing/manufacturing technologies

•Anisotropic/heterogeneous/composite materials

•Applied algebraic and differential geometry

•Applied computational geometry and topology

•Conceptual, collaborative, and distributed design

•Computational fabrication

•Curve, surface, and manifold modeling

•Dimensioning and tolerancing

•Feature modeling, recognition, and understanding

•Geometric algorithms

•Geometric and topological representations

•Geometric constraint solving and parametric modeling

•Geometric interpolation and smoothing

•Geometry generation and processing

•Geometry compression and transmission

•Isogeometric analysis

•Meshing and mesh optimization

•Multi-resolution modeling

•Numerical analysis of geometric algorithms

•Physically-based modeling and simulation

•Product data exchange, standards, and interoperability

•Reverse engineering/reconstruction of surfaces/solids

•Robustness and validity of geometric computations

•Shape modeling, synthesis, and analysis 

IMPORTANT DATES FOR THE SUBMISSION AND REVIEW OF FULL PAPERS:

Abstract for full papers: 

Tuesday, February 18, 2017

Full paper submission: 

Monday, February 24, 2017

First review notification: 

Friday, April 7, 2017

Final notification of acceptance: Friday, April 28, 2017

Camera ready full papers due: Friday, May 5, 2017

S3PM Convention chair: 

Vadim Shapiro (University of Wisconsin-Madison)

SPM Conference chair: 

Sara McMains (University of California, Berkeley)

SPM Program chairs:

Mario Botsch (Bielefeld University)

Stefanie Hahmann (University of Grenoble Alpes)

Jessica Zhang (Carnegie Mellon University)

For more details and submission instruction please visit:

https://s3pm.icsi.berkeley.edu/s3pm/spm.html