[General] 3D Vision -- Deadline March 17

(Apologies for multiple copies) Call for Submissions 3DV Conference (Third Joint 3DIM/3DPVT Conference) Web: http://www.3dv.org Email: chairs3dv(a)gmail.com https://mail.google.com/mail/u/0/images/cleardot.gif We invite submissions for the 3DV (3D Vision) conference to be held June 29 - July 1, 2013 in Seattle, Washington, following CVPR in nearby Portland, Oregon. This meeting will be a continuation of the successful 3DIM and 3DPVT conference series. Submissions are solicited on topics related to acquiring, modeling, analyzing, and visualizing 3D data. The event will provide a premier forum for disseminating ideas and results that cover a broad scope of topics related to 3D research in computer vision and graphics, from novel optical sensors, signal processing, geometric modeling, representation, and transmission, to visualization and interaction, and a variety of applications. The organizers invite you to submit high quality, original full research papers by March 17 2013. Note that the submission date for this conference occurs during the SIGGRAPH rebuttal period. Accommodations will be made for authors who want to retarget their SIGGRAPH submissions for this meeting. Topics of interest include, but are not limited to: ACQUISITION & MODELING . 3D cameras and sensors . Real-time 3D systems . Automated view planning . 3D sensor calibration . Image-based modeling . Shape-from-X . Shape and appearance modeling . 4D capture INTERACTION & VISUALIZATION . Image and video-based rendering . Interactive modeling . Augmented and mixed reality . 3D printing and rapid prototyping . Psychophysics of 3D sensing PROCESSING & TRANSMISSION . Geometric signal processing . Multi-resolution 3D representations . 3D shape retrieval and recognition . Shape analysis and morphology . 3D compression and transmission APPLICATIONS . Reverse engineering . Dimensional inspection & metrology . Cultural heritage & architecture . Medical visualization and analysis . Urban modeling . Robotics . 3D television . 3D tele-immersion . Forensics and security General Chair Brian Curless, University of Washington Program Co-Chairs Yasutaka Furukawa, Google Inc. Ioannis Stamos, City University of New York Camillo J. Taylor, University of Pennsylvania