[Apologies if you receive this CFP several times]
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NEWS
- Submission Deadline extended to April 17th
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CALL FOR PAPERS
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3rd WORKSHOP ON
DYNAMIC 3D IMAGING
IN CONJUNCTION WITH
Symp. of the German Association for Pattern Recognition, DAGM
September 08th, 2009, Jena, Germany
GENERAL INFORMATION
http://www.multi-sensorics.de/dyn3d
SCOPE
3D imaging sensors have been investigated for several decades. In recent
years, improvements on classical approaches such as stereo vision and
structured light on the one hand, and novel ToF-techniques on the other hand
have emerged, leading to 3D vision systems with radically improved
characteristics. Presently, these techniques make full-range 3D data
available at interactive frame rates, and thus open the path towards a much
broader application of 3D vision systems.
The workshop focuses on sensor systems, data processing approaches and
systems incorporating interactive, full-range 3D sensors in specific
application areas.
Topics of interest include, but are not limited to:
* Development of full-range 3D sensors or sensor systems, including
- active and passive 3D imaging systems
- sensor simulation
* Multi sensor fusion incorporating full-range 3D sensors
* Data processing for dynamic full-range 3D-data, including
- calibration techniques
- sensor based image synthesis
- 3D object recognition and tracking
- 3D optical flow
* Applications using interactive, full-range 3D sensors, e.g. in
areas like
- autonomous robotics
- medicine and health care
- industrial automation
- surveillance
- human-machine interaction
- automotive
Novel results of theoretical and practical significance based on interactive
3D vision will be considered. All accepted contributions will be published
in a volume of Springer Lecture Notes in Computer Science (LNCS).
IMPORTANT DATES
Submission of full papers: April 17th, 2009
Notification of acceptance: May 29th, 2009
Camera ready due: June 19th, 2009
Workshop: September 8th, 2009
ORGANIZING COMMITTEE and CONTACT
* Reinhard Koch (Chairman), U Kiel, Germany
* Andreas Kolb (Paper Chair), U Siegen, Germany
* Erhardt Barth, U Luebeck, Germany
* Rasmus Larsen, Tech. U. of Denmark, Kopenhagen, Denmark
PROGRAM COMMITTEE
* James Davis, U California, Santa Cruz, USA
* Joachim Denzler, U Jena, Germany
* Bjarne Ersboell, TU of Denmark, Kopenhagen, Denmark
* Jan-Michael Frahm, U North Carolina, USA
* Günther Greiner, U Erlangen, Germany
* Joachim Hornegger, U Erlangen, Germany
* Gaetan Koers, Melexis, Belgium
* Jörg Krüger, TU Berlin, Germany
* Klaus-Dieter Kuhnert, U Siegen, Germany
* Otmar Loffeld, U Siegen, Germany
* Bernd Jähne, U Heidelberg, Germany
* Marcus Magnor, TU Braunschweig, Germany
* Roberto Manduchi, U California, Santa Cruz, USA
* Thomas Moeslund, U Aalborg, Denmark
* Thierry Oggier, Mesa Imaging, Switzerland
* Abbas Rafii, Canesta, USA
* Thorsten Ringbeck, PMD Technologies, Germany
* Sudipta Sinha, U North Carolina, USA
* Wolfgang Straßer, U Tübingen, Germany
* Zengqui Sun, Tsinghua U Beijing, China
* Christian Theobalt, U Stanford, USA
* Peter Xu, Massey U, New Zealand
* Giora Yahav 3DV Systems, Israel
INSTRUCTION FOR AUTHORS
Contributions to the workshop should not exceed 14 pages. Please format your
article according to the Springer style guide for Lecture Notes in Computer
Science (LNCS) see
http://www.springer.de/lncs or the workshop website. All
submissions will be peer-reviewed by independent reviewers. Accepted papers
will be presented orally or as poster. All authors will be notified about
the acceptance or rejection of their paper after the reviewing process.
LOCATION AND REGISTRATION
The workshop will take place in conjunction with the Symp. of the German
Association for Pattern Recognition (DAGM) 2009 in Jena. Registration
information for the DAGM Symp. and this workshop can be found under:
http://dagm2009.org
Further information can be found on the workshop website:
http://www.multi-sensorics.de/dyn3d.
PARTNERS
In cooperation with:
* German Association for Pattern Recognition (DAGM)
* Eurographics
* ZESS, Center for Sensor Systems, Siegen
Sponsored by:
* PMD Technologies, Germany
* Mesa Imaging, Switzerland