CFP for Solid and Physical Modeling (SPM-2017). Abstract due Feb 18.
Dear friends,
We are preparing a wonderful convention next summer in Berkeley that will
focus on geometric and computational tools and paradigms for designing,
representing, analyzing, and simulating Shapes, Solids, and Structures.
Please consider contributing with paper submissions and your presence. Also,
please help us promote this CFP by forwarding to colleagues and students.
Hope to see you there.
- Vadim, Sara, Mario, Stefanie, Jessica, Leah
Solid and Physical Modeling (SPM-2017)
<https://s3pm.icsi.berkeley.edu/s3pm/spm.html>
https://s3pm.icsi.berkeley.edu/s3pm/spm.html
WHEN: SPM (June 19th 21st) followed by SMI (June 21st 23rd)
WHERE: UC Berkeley Campus, Berkeley, California, USA
The Symposium on Solid and Physical Modeling 2017 (SPM-2017) will be
co-located in Berkeley, California with Shape Modeling International (SMI)
as part of the International Convention on Shape, Solid, Structure &
Physical Modeling (S3PM-2017).
SPM seeks high quality, original research contributions that strive to
advance all aspects of geometric and physical modeling, and their
application in design, analysis and manufacturing, as well as in biomedical,
geophysical, digital entertainment, and other areas. The symposium is
organized with the support of the Solid Modeling Association (SMA), which
will award the 2017 Pierre Bézier Prize for contributions to solid, shape,
and physical modeling during the conference.
Accepted full-length papers will be published as a journal special issue in
Computer-Aided Design (Elsevier).
TOPICS:
3D fabrication/printing/manufacturing technologies
Anisotropic/heterogeneous/composite materials
Applied algebraic and differential geometry
Applied computational geometry and topology
Conceptual, collaborative, and distributed design
Computational fabrication
Curve, surface, and manifold modeling
Dimensioning and tolerancing
Feature modeling, recognition, and understanding
Geometric algorithms
Geometric and topological representations
Geometric constraint solving and parametric modeling
Geometric interpolation and smoothing
Geometry generation and processing
Geometry compression and transmission
Isogeometric analysis
Meshing and mesh optimization
Multi-resolution modeling
Numerical analysis of geometric algorithms
Physically-based modeling and simulation
Product data exchange, standards, and interoperability
Reverse engineering/reconstruction of surfaces/solids
Robustness and validity of geometric computations
Shape modeling, synthesis, and analysis
IMPORTANT DATES FOR THE SUBMISSION AND REVIEW OF FULL PAPERS:
Abstract for full papers:
Tuesday, February 18, 2017
Full paper submission:
Monday, February 24, 2017
First review notification:
Friday, April 7, 2017
Final notification of acceptance: Friday, April 28, 2017
Camera ready full papers due: Friday, May 5, 2017
S3PM Convention chair:
Vadim Shapiro (University of Wisconsin-Madison)
SPM Conference chair:
Sara McMains (University of California, Berkeley)
SPM Program chairs:
Mario Botsch (Bielefeld University)
Stefanie Hahmann (University of Grenoble Alpes)
Jessica Zhang (Carnegie Mellon University)
For more details and submission instruction please visit:
<https://s3pm.icsi.berkeley.edu/s3pm/spm.html>
https://s3pm.icsi.berkeley.edu/s3pm/spm.html